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Device: Am29PDL640GxxWH [FBGA63]

Manufacturer: Spansion

Part number description for this device:

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Am Spansion Memory - originally developed by AMD
XX Product Series 29 = Sector erase NOR flash memory
XXX Device Family BDS = 1.8 V, Simultaneous Read-Write, Burst
DS = 1.8 V Simultaneous Read-Write
SL = 1.8 V
LV = 3.0 V
DL = 3.0 V, Simultaneous Read-Write
BL = 3.0 V, Burst
PL = 3.0 V, Page
PDL = 3.0 V, Simultaneous Read-Write, Page
F = 5.0 V
XXX Density  
X Process Technology B = 320 nm Floating Gate
C = 320 nm Floating Gate
D = 230 nm Floating Gate
G = 170 nm Floating Gate
H = 130 nm Floating Gate
M = 230 nm MirrorBit
X Sector Architecture U, Blank = Uniform sector
T = Top boot sector
B = Bottom boot sector
H = Uniform sector, WP# protects highest addressed sector
L = Uniform sector, WP# protects lowest addressed sector
XXX(R) Speed Option - "R" indicates regulated voltage range
XX Package Type J = PLCC
K = PQFP
P = Plastic DIP
S = SOP
SK = reverse SOP
Z = SSOP
E = TSOP
E2 = TSOP-II
F = reverse TSOP
F2 = reverse TSOP-II
MA = FBGA 63, 11 x 12 mm, 0.8 mm pitch
MD = FBGA 63, 10.95 x 11.95 mm, 0.8 mm pitch
VA = FBGA 44, 9.2 x 8 mm, 0.5 mm pitch
VK = FBGA 80, 11.5 x 9 mm, 0.8 mm pitch
VR = VFBGA 48, 8.15x6.15 mm, 0.8 mm pitch
VM = FBGA 64, 8 x 9 mm, 0.8 mm pitch
WA = FBGA 48, 6 x 8 mm, 0.8 mm pitch
WB = FBGA 48, 6 x 9 mm, 0.8 mm pitch
WC = FBGA 48, 8 x 9 mm, 0.8 mm pitch
WD = FBGA 63, 8 x 14 mm, 0.8 mm pitch
WG = FBGA 40, 8 x 15 mm, 0.8 mm pitch
WH = FBGA 63, 12 x 11 mm, 0.8 mm pitch
WK = FBGA 47, 7 x 10 mm, 0.5 mm pitch
WL = FBGA 48, 11 x 10 mm, 0.5 mm pitch
WM = FBGA 48, 6 x 12 mm, 0.8 mm pitch
WP = FBGA 84, 11 x 12 mm, 0.8 mm pitch
WS = FBGA 80, 11 x 12 mm, 0.8 mm pitch
PA = FBGA 64, 13 x 11 mm, 1.0 mm pitch
PB = FBGA 80, 13 x 11 mm, 1.0 mm pitch
PC = FBGA 64, 13 x 11 mm, 1.0 mm pitch
PE = FBGA 80, 10 x 15 mm, 1.0 mm pitch
PG = FBGA 64, 18 x 12 mm, 1.0 mm pitch
PH = FBGA 80, 13 x 11 mm, 1.0 mm pitch
PI = FBGA 80, 11 x 12 mm, 1.0 mm pitch
X Temperature Range C = Commercial
I = Industrial
E = Extended
X Optional Processing Blank = Standard
N = ESN device

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0245/0991 (70-0245/0991) = BGA-Bottom-1 (70-0245) + BGA-Top-185 ZIF (70-0991)
BeeHive208S adapter/module: BGA-0245/0991 (70-0245/0991) = BGA-Bottom-1 (70-0245) + BGA-Top-185 ZIF (70-0991)
BeeProg2 adapter/module: BGA-0245/0991 (70-0245/0991) = BGA-Bottom-1 (70-0245) + BGA-Top-185 ZIF (70-0991)
BeeProg2C adapter/module: BGA-0245/0991 (70-0245/0991) = BGA-Bottom-1 (70-0245) + BGA-Top-185 ZIF (70-0991)
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